Fokus: forretningsudvikling, kapitalfremskaffelse
Intro
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Danish deep-tech startup that created the first ever atomic layer 3D printing technology for on-demand advanced electronic materials development and advanced manufacturing of micro and optoelectronics with atomic precision material versatility with 450+ different materials. For on Earth and Space applications.
The technology offers unique technical solutions to several industries via printing on previously impossible surfaces, atomically precise layers, 10x faster and offers 97% cost reduction.
In 2020 they received 2M euros on account and 13.5M euros with consortium partners and secured investment and collaboration projects from Sony.
Now establishing pilot projects with potential customers within aerospace applications, biopharma and semiconductor and optics industry.
Points for sparring
The company is in growth phase and experience corresponding challenges.
1.Setting up effective operations and company growth structure and governance
2.Engaging investors - how to obtain venture financing in the next financial round?
3.Go2market strategy - how to structure market access and projects
Industry: Machinery and equipment industry, Electrical equipment/Electronics, Research
Stage of Development: Proof of Concept
Region: Capital Region
Skills:
B2B
Distribution channels
Exit strategy
Financing, Funding & Raising Capital
Business Models
Business Development (M&A)
HR
Internationalisation
Investor Pitch
Management
Market knowledge Europe
Market knowledge North America
Organizational Development
Strategy and growth plans
Operations & Action Plana
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Product & Offering
The company’s technology is the first-ever, most accurate and versatile atomic layer advanced manufacturing technology for electronic materials development, prototyping and manufacturing of micro and nanodevices. The company developed a tool that enables smart & cost-efficient electronic materials, micro and nanodevice rapid processing in days, instead of months or years, outside of cleanrooms for research and industrial needs. The company’s technology offers unique technical solutions to several industries via printing on previously impossible surfaces, atomically precise layers, 10x faster, offers 97% cost reduction and 450+ materials.
Technology
The technology consists of a combination of four advanced technologies: atomic layer deposition (ALD), microtechnology, high precision mechatronics and advanced software solution. The patent-pending technology provides highly conformal, direct material deposition, and removal with atomic precision and material versatility. The process works with reactive gases that create self-controlled surface chemical reactions, repeated in cycles, and allows selected patterns and structure with atomic precision.
Market description
The company targets to set itself as a pioneer and leader in atomic layer advanced manufacturing in the high-resolution micro- and nanofabrication application markets. The initial targeted application market is MEMS and Sensors with €28B CAGR of 10.4% with the current technology maturity, followed by Advanced Packaging(€36B), RF Devices (€2.3B), Advanced Materials & Multipurpose R&D (€545B), Optics/Photonics(€541B), MicroIC(€245B), etc. Assuming that the total addressable market with a bottom-up approach is about at least €4.5B and it is derived from approx. 11.000 potential customers, and excludes other sources of revenues. The company plans to reach ~1% of the TAM by 2025, this represents around €30.3M revenues via MaaS (Microfabrication as a Service), direct and distributor channels sales, IP licensing fees, consumables sales, and on-demand printing services.
Business model
The company is entering the market with MaaS in order to secure confidence in target customers on the broad capabilities of our technology, followed by equipment sales and finally entering the industrial scale. 1) Manufacturing as a Service (2021), 2) Systems sales, leasing, and subscription (2022), 3) Consumables sales and support services (2022), 4) Licensing and white labelling (2025).
Competition
The company created a new domain with the only indirect competition, which competes with existing solutions: 1) Conventional thin-film: Oxford Instruments, BENEQ, PICOSUN etc. 2) 3D microscale printing: Nanoscribe, Optomec, VSparticle, Keyron Printing Technologies 3) Photolithography: HEIDELBERG Instruments, SUSS Microtech.
Status
The company has an extensive network of R&D and industrial partners, including leading eurotech universities, Fraunhofer network, SUPSI, TNO, DTI and industrial companies from CH, NL, SK, LT that help develop the technology further.
During 2020 the company has been working on the development of three machines, as well as researching new processes in order to address demand in the market for different materials, on different surfaces and for the purpose of integrating sensors on microdevices. The company has demonstrated the competitive advantage of the technology compared to traditional microfabrication techniques in R&D and R&I pilot projects. From March 2021 the company will develop a fourth modular machine for large-scale manufacturing. From August 2020 the company develops a PoC prototype for NASA for space use.
During 2020, the company obtained tech transfer from academic partners. Now the team works on proceeding with the patent in PCT phase and preparation of two more patents.
The company is in the process of establishing pilot projects with potential customers within aerospace applications, biopharma and semiconductor and optics industry.
Questions for the panel
The company is in growth phase and experience corresponding challenges.
1.Setting up effective operations and company growth structure and governance.
How to grow the team and organization in the way to keep governance and balance the leadership and management.
2.Engaging investors - how to obtain venture financing in the next financial round?
3.Go2market strategy - how to structure market access and projects to provide best value to the customers and maintain minimal team required for execution.
